Device for heat dissipation from an endoscopic illumination apparatus

ABSTRACT

Device for an endoscopic illumination apparatus comprising a heat pipe having a first end region and a second end region; a first heat source; a heat dissipation element for dissipating thermal energy from said first heat source; a heat sink spaced apart from the first heat source; and a clamping element, wherein the clamping element is reversibly detachably mounted on the heat dissipation element such that the first end region of the heat pipe is held between the heat dissipation element and the clamping element, wherein the heat pipe is adapted to conduct the thermal energy of the heat source to the heat sink, wherein the second end region of the heat pipe is spaced apart from the first end region, and wherein the second end region ends in the heat sink.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority from German patent application 10 2019114 885.5, filed on Jun. 3, 2019. The entire contents of this priorityapplication is incorporated herein by reference.

BACKGROUND OF THE DISCLOSURE

The present disclosure relates to a device for an endoscopicillumination apparatus and an endoscopic illumination apparatus withsaid device.

Endoscopes are used both in the technical field and in the medical fieldand are particularly suitable for inspection of areas which aredifficult to access and therefore, are not observable with the nakedeye. For example, in the technical field, endoscopes are used for workin cavities in machines, engines, turbines and reaction chambers, etc.which cannot be inspected with the naked eye.

In medical endoscopy, endoscopes are used in minimally invasive surgery,where required in combination with surgical instruments, for examinationpurposes or for operations under visual control or for the applicationof diagnostic or therapeutic light.

On the one hand, endoscopes comprise an imaging system that serves toreceive observation light from the observation room or operating roomand to transmit image information from distal to proximal.

The imaging system may be an optical image transmission systemcomprising an objective in the distal end of a shaft and a lens systemwhich is adjacent to said objective. The lens system may be, forexample, a relay system or may comprise an ordered fiber bundle and aproximal ocular. It is also possible that a camera is connectable.

Another component of endoscopes is an illumination system which servesto transmit light from proximal to distal in order to illuminate theobservation room or examination room with light. Conventionalhigh-performance light-emitting diodes (LEDs) are used for illumination.This technology particularly offers the advantage that, in comparison toxenon technology, it enables an almost constant light performance over along lifetime and also guarantees a constant quality of illumination ofthe light sources. A further advantage of LED technology is thatextended diagnostics such as ICG (indocyanine green) and PDD(photodynamic diagnostics) can be realized by combining LEDs ofdifferent spectra.

In order to guarantee the high performance and long lifetime of LEDtechnology, a sufficiently dimensioned cooling management is essential,since the applied LEDs continue to represent heat sources despite theirhigh efficiency due to their high light performance.

The rejected heat produced by the LEDs or light sources can, forexample, be dissipated into an endoscope housing (see e.g. U.S. Pat. No.8,696,554 B2). However, this solution of heat dissipation may lead to aheat accumulation, which may cause overheating of the LEDs and theirperipherals. It is therefore advantageous if the generated heat isconducted from its point of origin to a heat sink (e.g. in the form of acooling body). In the simplest case, this may be achieved by providingflow passages within the housing of the endoscope, through which an airflow is initiated, for example, by a fan (see U.S. Pat. No. 5,099,399A). This solution is disadvantageous, however, since the flow passageswithin the housing limit the freedom of design of the housing.

A possibility to increase the freedom of structural design and heatdissipation performance is to separate the heat source and heat sink byusing so-called heat pipes. These heat pipes, which are also called heatconduction tubes, allow, for example, a fluidically optimal positioningof the heat sink within the endoscopic illumination apparatus and servefor heat exchange between the heat source and the heat sink.

The connection of heat pipes to the heat sources may be carried out, forexample, by soldering or welding. In addition, the heat pipes may alsobe integrally connected to the heat source. An example of heatdissipation using heat pipes can be found in JP 2014-045820 A and EP 1731 862 A1. JP 2014-045820 A and EP 1 731 862 A1 each relate to a designin which the heat pipe is integrally connected to the heat source.

SUMMARY OF THE DISCLOSURE

It is an object to further develop a device for heat dissipation from anendoscopic illumination apparatus in such a way that a higher degree offreedom in structural design and/or an increase in the heat dissipationcapacity may be reached.

The object is solved by device for an endoscopic illumination apparatuscomprising a heat pipe having a first end region and a second endregion, a first heat source, a heat dissipation element for dissipatingthermal energy from said first heat source, a heat sink spaced apartfrom the first heat source, and a clamping element. The clamping elementis reversibly detachably mounted on the heat dissipation element suchthat the first end region of the heat pipe is held between the heatdissipation element and the clamping element. The heat pipe is adaptedto conduct the thermal energy of the heat source to the heat sink. Thesecond end region of the heat pipe is spaced apart from the first endregion, and the second end region ends in the heat sink.

Due to the way the heat pipe functions, a temperature gradient occursbetween the hot end of the heat pipe, which is located at the heatsource, and the cold end of the heat pipe, which is located in the heatsink, during the heat dissipation of the heat generated by the heatsource. This temperature gradient leads to different, material-relatedtemperature expansions along the heat pipe.

The inventors have recognized that, due to the rigid attachment of therespective ends of the heat pipe to the heat source or heat sink,resulting internal stresses may be transferred to other components ofthe endoscopic illumination apparatus. This may, for example, impairaccuracy of image acquisition.

It was also recognized that due to the manufacturing tolerances of theheat pipes positioning of the heat sources (in particular LEDs) relativeto the heat pipes may be highly demanding. Also, the positioning may beassociated with a high degree of adjustment and assembly effort, sincethe arrangement of the heat pipes is limited, for example, due to apredetermined position and orientation of the imaging system, inparticular the lens system and the objective (e.g., a glass rod).

In this context, the inventors have recognized that, for example,parallel heat dissipation (a straight-line course of the heat pipes) maybe difficult to realize and that the heat pipes for placement in thehousing of the endoscopic lighting apparatus may generally follow acurved course, which may increase the consequences of distortion ordeformation due to internal stress.

One of the advantages of the embodiment may be, in contrast to the priorart, the heat pipe may not be permanently connected to the heat sourceor the heat dissipation element of the heat source but may be reversiblydetachably mounted. By arranging the heat pipe between the heatdissipation element and the clamping element, i.e. by clamping orrestraining the heat pipe, it may not be fixedly connected with one endto the heat dissipation element, but may only be clamped in place bymeans of a force fit. This means that in particular the aforementionedinternal stresses may no longer be transferred to the componentssurrounding the heat pipe.

The surface area available for heat transfer may also be increased bylocating the heat pipe between the heat dissipation element and theclamping element, since the heat pipe is enclosed by the heatdissipation element and the clamping element in the first end region.This means that the entire outer surface of the first end region of theheat pipe may be available for heat transfer.

In addition, this attachment of the heat pipe may significantly increasethe freedom of structural design, since both the heat dissipationelement and the clamping element may be adapted to a particular courseof the heat pipe. Thus, a modular arrangement of the heat pipe may bepossible. In addition, for example, the aforementioned manufacturingtolerances of the heat pipe may be compensated for in the overallsystem, which in turn may be reflected in increased freedom ofstructural design.

The embodiment may offer a suitable option, in particular forretrofitting, i.e. for the subsequent modification of individualcomponents, since the clamping mechanism may be reversibly detachable.This means, for example, that the heat pipe may be easily replaced. Insome exemplary embodiments, the heat pipe may also be soldered to theheat sink, wherein in such a case, the heat sink and heat pipe may bereplaced together in a retrofit.

In other words, the heat dissipation element may be mounted in a preciseposition on the heat source, which may be, for example, a component ofan optical unit of an endoscopic illumination apparatus. In contrast tothe state of the art, however, the heat pipe may not be connected bysoldering or welding, i.e. not by a form-fitting, nonreversible process,but by using the clamping element.

The terms “heat dissipation element” and “clamping element” in this casemay be understood, in some exemplary embodiments, to mean a plate- orcuboid-shaped body, e.g. made of a metal or an alloy. In an exemplaryembodiment, the body may comprise one or more recesses. In someexemplary embodiments, the recesses may be adapted to accommodate theheat pipe at least partially. A rod-shaped end section of the heat pipemay, for example, be accommodated proportionally in a recess of the heatdissipation element and proportionally in a recess of the clampingelement corresponding to the recess of the heat dissipation element inthe mold, such that the end region of the heat pipe may be, in anexemplary embodiment, completely enclosed by both recesses.

The term “heat pipe” in this case means a heat conducting pipe. Heatpipes, in some exemplary embodiments, may include metal vessels ofelongated shape which may have a hermetically sealed volume. The volumemay be filled with a working medium (e.g. water or ammonia) which mayfill the volume to a small extent in the liquid state and to arelatively larger extent in the gaseous state. The working medium may bevaporized in the area of the heat source while the heat pipe is in use.The working medium condenses again in the area of the heat sink andreturns to the area of the heat conduction tube on the heat source side,driven by capillary forces.

Furthermore, the term “heat pipe” may also be used to describe a metalrod made of solid material, e.g. with a round or rectangular crosssection, in which heat transport takes place by conduction, i.e. by thetransfer of kinetic energy between adjacent atoms of the metal rodwithout material transport.

According to an exemplary embodiment, the heat source is a light source.

The term “light source” may be, in some exemplary embodiments,understood to mean a light-emitting diode (short: LED). In principle,however, a xenon light may also be used as a light source, whereinlight-emitting diodes may be used due to their longer lifetime incomparison to xenon lights as well as due to their higher efficiency.

According to another exemplary embodiment, the clamping element isdetachably screwed, pinned or bolted to the heat dissipation element.

This embodiment may have the advantage that the clamping element may beeasily mounted to the heat dissipation element but may also be easilyremoved from it. For some exemplary embodiments, the clamping elementmay be connected to the heat dissipation element via one or more screwsor bolts. When pinning (i.e. inserting bolts for fastening), in someexemplary embodiments, so-called safety pins may be used to prevent thepins from being pulled out.

According to another exemplary embodiment, the heat pipe, the heatdissipation element and the clamping element are each made of athermally conductive material.

The thermally conductive material may be adapted such that the heatgenerated at the heat source or by the light-emitting diode maysubstantially be completely transferred from the heat dissipationelement to the heat pipe without any heat build-up due to heat transferinhibiting properties, respectively. Here, the heat transfer between theheat dissipation element and the heat pipe may take place via a commoninterface. This means that, in some exemplary embodiments, there may beno air gap between the heat dissipation element and the heat pipe, whichair gap has an insulating effect for heat transport. In an exemplaryembodiment, the heat pipe and the heat dissipation element may be madeof copper, the clamping element may be made of aluminum. However, insome exemplary embodiments, the heat pipe, the heat dissipation elementand the clamping element may all be made of the same thermallyconductive material.

According to another exemplary embodiment, the thermally conductivematerial comprises aluminum or copper or is aluminum or copper.

Here, both thermally conductive materials that only contain copperand/or aluminum, for example, as an alloy component, as well as thosethat consist of pure copper or aluminum are included. In this context,it does not depend on the proportion of copper and/or aluminum in thethermally conductive material as long as the thermal conductivity of thethermally conductive material is expected to be substantially (±20%)equal to the thermal conductivity of copper or aluminum.

According to a further embodiment, a heat-conducting paste for thermalcoupling is applied between a surface of the heat dissipation element, asurface of the first end region of the heat pipe and a surface of theclamping element.

One advantage of the additionally applied heat-conducting paste may bethat the thermal conductivity may thereby be increased in the region ofthe boundary layer, i.e. in the region where the respective surfaces ofthe heat dissipation element, the first end region of the heat pipe andthe clamping element get into contact with each other. For example, theheat-conducting paste may also be applied only in the contact region ofthe surface of the heat dissipation element and the surface of the firstend region of the heat pipe, since the majority of the heat transfer ofthe heat to be dissipated takes place in this contact region. Instead ofheat-conducting paste, a heat-conducting pad may also be used.Alternatively or in addition, a heat-conducting paste or pad may beplaced between the light source (i.e. a LED) and the heat dissipationelement.

The surface may understood to be, for example, the surface of a wall orwall section of the heat dissipation element, of the first end region ofthe heat pipe or of the clamping element, respectively.

The first end region of the heat pipe may be the region that is clampedbetween the heat dissipation element and the clamping element in theassembled state.

According to another exemplary embodiment, the device further comprisesa second heat pipe, a second heat dissipating element, a second clampingelement, and a second heat source, the second heat pipe having a firstend region and a second end region, wherein the second heat dissipationelement is adapted to dissipate thermal energy from the second heatsource. The second clamping element is reversibly detachably mounted onthe second heat dissipation element such that the first end region ofthe second heat pipe is held between the second heat dissipation elementand the second clamping element. The second heat pipe is adapted toconduct the thermal energy of the second heat source to the heat sink,wherein the second end region of the second heat pipe is spaced apartfrom the first end region, and wherein the second heat pipe ends in theheat sink.

This embodiment includes in particular a design in which, for example,two light-emitting diodes are used as light sources, each of which inturn produces rejected heat. In this embodiment, each heat source hasits own heat dissipation element. The heat of the respective heat sourceis conducted via the respective heat pipe to the heat sink, which may bea common heat sink, wherein embodiments are also conceivable where thesecond heat pipe ends in a second heat sink which is arranged separatelyfrom the first heat sink. This embodiment may have the advantage thatthe flexibility of the arrangement of the first and second heat sourceand thus the flexibility of the device is increased.

According to another embodiment, the device further comprises a secondheat pipe, a second clamping element, and a second heat source, thesecond heat pipe having a first end region and a second end region,wherein the heat dissipation element is further adapted to dissipatethermal energy from the second heat source. The second clamping elementis reversibly releasably mounted on the heat dissipation element suchthat the first end region of the second heat pipe is held between theheat dissipation element and the second clamping element. The secondheat pipe is adapted to conduct the thermal energy of the second heatsource to the heat sink, wherein the second end region of the secondheat pipe is spaced apart from the first end region, and wherein thesecond heat pipe ends in the heat sink.

This embodiment may have the advantage that a common heat dissipationelement can be used, especially when the two heat sources are arrangedadjacent to one another. The two heat pipes are therefore mounted withtwo clamping elements on only one common heat dissipation element,which, in some exemplary embodiments, is adapted such that it can absorbthe heat generated in the two heat sources relatively close to itsrespective point of origin.

In another exemplary embodiment, the second heat source is a secondlight source. For the second light source, the aforementioned withrespect to the first light source applies accordingly.

In a further exemplary embodiment, the endoscopic illumination apparatusfurther comprises a cooling body forming the heat sink of the deviceand, in some exemplary embodiments, comprises a plurality of coolingfins. In addition, the endoscopic illumination apparatus, in someexemplary embodiments, comprises a fan adapted to force an air flow in adirection towards the heat sink or in a direction away from the heatsink.

In the present case, the term “cooling body” may be understood to mean,for example, a block-like metallic body which is shaped in such a waythat its heat-emitting surface is enlarged in comparison with acontinuous metallic cuboid. The increase in surface area may beachieved, for example, by a large number of notches and/or bulges.

The fan or blower, in some exemplary embodiments, may be adapted toaccelerate stationary ambient air by rotating the rotor blades in such away that a forced air flow is created, which may, in some exemplaryembodiments, flow directly against the heat sink or draws the airsurrounding the heat sink directly away from it. In some exemplaryembodiments, the fan is located at or near the heat sink.

It is noted that the previously indicated features and the features thatwill be explained in the following cannot only be provided in theexplicitly disclosed combination but also in other combinations or evenin isolation without departing from the scope of and spirit of thepresent disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments are disclosed in the drawings and are explained in thefollowing description. In the figures:

FIG. 1 is a top view of an endoscopic lighting apparatus with arefinement of the device;

FIG. 2 is a perspective view of the refinement of the device;

FIG. 3 is a top view of the refinement shown in FIG. 2;

FIG. 4 is a perspective view of a second refinement of the device;

FIG. 5 is an exploded view of the second refinement;

FIG. 6 is a perspective view of a first refinement of the clampingelement;

FIG. 7 is a perspective view of a second refinement of the clampingelement;

FIG. 8 is a perspective view of heat pipes and heat sink in the solderedstate;

FIG. 9 is a sectional view of the perspective view shown in FIG. 8; and

FIG. 10 is a sectional view of the heat pipe(s) in the clamped state.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

FIG. 1 shows an endoscopic lighting apparatus with a refinement of thedevice. The endoscopic lighting apparatus is marked in its entirety withthe reference number 100, the device with the reference number 10.

In the refinement shown in FIG. 1, the endoscopic illuminating apparatus100 comprises the device 10, an optical unit 12, a light source driverboard 14 and a power supply unit 16 as main components.

A main board is not shown in the sectional view. The main board may bearranged above the power supply unit 16 and may be seen as the controland evaluation unit of the endoscopic illumination apparatus 100. Thepower supply unit 16 is adapted to supply the endoscopic illuminationapparatus 100 and all its components with electrical energy andcomprises, for example, a power of up to 150 W with convection cooling,up to 250 W with conduction cooling and up to 550 W with forced cooling.

The optical unit 12 forms the “core” of the endoscopic illuminationapparatus 100 and is adapted to focus light emitted by one or more lightsources 18, 18′ in such a way that the light is introduced as aconcentrated light beam into a light guide 20. Here, the optical unit 12comprises a basic carrier, which may be, for example, made of aluminum.The first and the second light source 18, 18′ are plate-shaped lightemitting diodes (e.g. in SMD design). The first and second light source18, 18′ are arranged orthogonally to each other. The first light source18 is arranged opposite the light guide 20, thus facing the latter.

An optical lens 22 (e.g. a collimator optic) is arranged in front of thefirst and the second light source 18, 18′ and in front of the lightguide 20, respectively. The lenses 22 may each be held by a lens holder.The lenses 22 are adapted to align or collimate the light generated bythe light sources 18, 18′. The optics 22, 22′, 22″ connected in front ofthe first and the second light source 18, 18′ focus the generated lighton a center of a beam splitter 24. The beam splitter 24 is aligned withrespect to the two light sources 18, 18′ in such a way that it has a 45°position to each of the two light sources 18, 18′.

The beam splitter 24 is adapted to allow the light from the first lightsource 18 to pass in a straight line, i.e. without deflection, in thedirection of the light guide 20, whereas the beam splitter 24 deflectsthe light originating from the second light source 18′ and collimated bythe lens 22′ by 90° in the direction of the light guide 20. For thispurpose, the beam splitter 24 may, for example, have a partiallytransmissive coating. The light directed into the light guide 20 iscollimated again by the lens 22″ before entering the light guide 20. Thelight collimated by the optical unit 12 in this way can be directedthrough the light guide 20 to a location to be illuminated by theendoscopic illumination apparatus 100.

To control the light sources 18, 18′ during operation, the main boardmay be supplied with electrical energy by means of the power supply unit16. Control signals for controlling the light sources 18, 18′ may betransmitted from the main board to the respective light source driverboard. The light source driver board(s) transforms the power to therespective light source 18, 18′. Although the light sources 18, 18′ arehigh-power light-emitting diodes having a high efficiency, duringoperation of the two light sources 18, 18′ rejected heat is generatedwhich, if not dissipated, can lead to a heat accumulation, e.g. in ahousing 26 of the endoscopic illumination apparatus 100. The lightsources 18, 18′ are therefore heat sources 28, 28′, wherein the firstlight source 18 represents a first heat source 28 and the second lightsource 18′ represents a second heat source 28′. In other configurationsalso only one heat source 28, 28′ or one light source 18, 18′ may bepresent.

To dissipate the thermal energy (or rejected heat) generated at thelight sources 18, 18′, the device 10 comprises a heat dissipationelement 30, 30′. In the present case, the device 10 comprises a firstheat dissipation element 30 and a second heat dissipation element 30′.The first heat dissipation element 30 is arranged in a direct peripheryof the first heat source 28. The second heat dissipation element 30′ isarranged in a direct periphery of the second heat source 28′. The lightsources 18, 18′ may be mounted on the heat dissipation elements 30, 30′.The heat dissipation elements 30, 30′ may be connected to the basecarrier of the optical unit 12. In other refinements, which are notshown here, only one heat dissipation element 30, 30′ can be used, whichis further adapted to dissipate the thermal energy of both heat sources28, 28′. Such a heat dissipation element 30, 30′ may, for example, havean L-shape and thus may be adapted to dissipate the thermal energy fromboth the first and the second heat source 28, 28′. In a furtherrefinement, three or more heat dissipation elements may also be used,wherein the number of heat dissipation elements can be determined, forexample, on the basis of the power loss to be dissipated.

The thermal energy of the first heat source 28 dissipated by the firstheat dissipation element 30 is dissipated via a first heat pipe 32 to aheat sink 34 which is at a distance from the first heat source 28. Inthe present case, the device also comprises a second heat pipe 32′. Thefirst and second heat pipe 32, 32′ may each comprise a plurality (>2) ofheat pipes. The thermal energy of the second heat source 28′ dissipatedby the second heat dissipation element 30′ is dissipated via the secondheat pipe 32′ to the heat sink 34 which is at a distance from the secondheat source 28. In the present case, the heat sink 34 is formed by acooling body 36, which may be a laminated aluminum cooling body. Inother refinements, however, the cooling body 36 may also be a differenttype of cooling body (e.g. with a finned structure, an extruded coolingbody or a forged cooling body) or may be composed of several coolingbodies lined up or arranged side by side. In principle, it is alsopossible that the device 10 comprises two separate heat sinks 34.

In the present case, the first and second heat pipe 32, 32′ are tubularor rod-shaped and differ in their respective shape. Here the shape, i.e.the course of the tube, of the respective heat pipe 32, 32′ is adaptedto the position and positioning of the heat dissipation elements 30,30′. The heat pipes 32, 32′, for example, comprise several straight pipesections as well as several bends and/or bent pipe sections.

The first heat pipe 32 is reversibly detachably mounted on the firstheat dissipation element 30 by means of a first clamping element 38 suchthat a first end region 40 of the first heat pipe 32 is held between thefirst heat dissipation element 30 and the first clamping element 38. Thesecond heat pipe 32′ may be reversibly detachably mounted on the secondheat dissipation element 30′ by means of a second clamping element 38′such that a first end region 40′ of the second heat pipe 38′ is heldbetween the second heat dissipation element 30′ and the second clampingelement 38′. In a case where there is only one heat dissipation element30, 30′, where both clamping elements 38, 38′ may be mounted on thesingle heat dissipation element 30, 30′.

In the present case, the first and the second heat pipe 38, 38′ areadapted to conduct the thermal energy of the first and second heatsource 28, 28′ to the heat sink 34, which is spaced apart from the heatsources 28, 28′. A second end region 42 of the first heat pipe 32, whichis spaced apart from the first end region 40, ends in the heat sink 34,and a second end region 42′ of the second heat pipe 32′, spaced apartfrom the first end region 40′ of the second heat pipe 32′, and may alsoend in the heat sink 34 (see in particular FIG. 5).

The endoscopic lighting apparatus 100 of FIG. 1 comprises, in additionto the cooling body 36 forming the heat sink 34, a fan 44, which isadapted to force an air flow into the direction 45 of the heat sink 36or in the opposite direction 45′ away from said heat sink 36. In thepresent case, the fan 44 generates an air flow pointing into thedirection 45 of the heat sink 36. In other refinements, a suction fan 44may also be used, which sucks the air in the opposite direction 45′ awayfrom heat sink 36. In addition, in FIG. 1 another fan 44 is arranged inthe periphery of the power supply unit 16 and is adapted to suck thethermal energy emitted by the power supply unit 16, the light sourcedriver board 14 and the, in some exemplary embodiments, overlying mainboard (not shown), out of the housing 26. In a further refinement, thefan 44 can also be arranged on heat sink 36 such that air can be suckedthrough the heat sink.

For a better overview, FIGS. 2 and 3 again show the device 10 togetherwith the optical unit 12 in an insulated form, i.e. without theremaining components of the endoscopic lighting apparatus 100 shown inFIG. 1.

FIGS. 4 and 5 show the device 10 as a refinement in a perspective view(FIG. 4) and in an exploded view (FIG. 5). In FIG. 4 it can be seen thatboth the first heat pipe 32 and the second heat pipe 32′ each comprise aplurality (in the present case, each four) of heat conducting tubes,which are led from the first and second heat dissipation element 30, 30′to the heat sink 36 and which both end in the latter. The respectivesecond end regions 42, 42′ of the first and second heat pipe 32, 32′ endin the heat sink 36 and, in the present case, penetrate it completelywhen viewed in a transverse direction of the heat sink 36.

The heat dissipation elements 30, 30′ may each be plate-shaped andcomprise several recesses 46. The clamping elements 38, 38′ may comprisethe same number of recesses 46 as the heat dissipation elements 30, 30′.Thus, the first end region 40 of the first heat pipe 32 can be enclosedby the first heat dissipation element 30 and the first clamping element38. The first end region 40′ of the second heat pipe 32′ may be enclosedby the second heat dissipation element 30′ and the second clampingelement 38′. In some exemplary embodiments, the first and/or second heatpipes 32, 32′ may be tubular.

In FIG. 4, the clamping elements 38, 38′ are each attached to therespective heat dissipation element 30, 30′ by several screws 48. Inother refinements, the clamping elements 38, 38′ may also be attached tothe heat dissipation elements 30, 30′, for example by bolts.

In the exploded view of the device 10 in FIG. 5, it can be seen that therespective first end regions 40, 40′ as well as the respective secondend regions 42, 42′ of the first and second heat pipe 32, 32′ run in astraight line and are tapered at an outer end of the conical shaped heatpipe, respectively.

The two heat dissipation elements 30, 30′ may be mounted to the opticalunit 12 with several bolts 52 (not shown here). A fan mounting frame 50may be mounted, e.g. using several screws, on the heat sink 36, whichfan mounting frame 50 is adapted to provide a mounting platform for thefan 44.

A heat-conducting paste for thermal coupling may also be applied betweena surface of the first heat dissipation element 30, a surface of thefirst end region 40 of the first heat pipe 32 and a surface of the firstclamping element 38. In other configurations, one or moreheat-conducting pads and/or heat-conducting paste may be applied betweenthe light sources 18, 18′ and the heat dissipating elements 30, 30′.

FIGS. 6 and 7 show two refinements of the clamping element 38, 38′,wherein the clamping element 38 shown in FIG. 6 differs from theclamping element 38′ shown in FIG. 7 in that it comprises an additionalnotch 54 on one side of its rectangular outer edge. The notch 54 has nofunctional advantage but is of a purely constructive nature. As can beseen in FIGS. 6 and 7, the rectangular body of the clamping elements 38,38′ is traversed in a transverse direction by the severalsemi-cylindrical recesses 46.

FIG. 8 shows a perspective view of the heat pipes 32, 32′ in a statewhere the heat pipes 32, 32′ are soldered to the heat sink 36. It can beseen that the first end regions 40, 40′ of the heat pipes 32, 32′ areexposed, i.e. not clamped with the heat dissipation elements 30, 30′ andthe clamping elements 38. FIG. 9 shows a sectional view of FIG. 8. Itcan be seen that the heat pipes 32, 32′ penetrate the cooling body 36 ina transverse direction and are soldered to it.

FIG. 10 shows another sectional view of the heat pipes 32, 32′ in aclamped/screwed state. Here, the heat pipes 32, 32′ are clamped betweenthe heat dissipation element 30, 30′ and the clamping element 38. In thepresent case, the clamping is done by screwing via the screws 48.

What is claimed is: 1-20. (canceled)
 21. A heat dissipating deviceconfigured to dissipate heat from an endoscopic illumination devicecomprising: one or more a heat pipes each including a first end portionand a second end portion; a heat dissipation element configured todissipate thermal energy from a first heat source associated with theendoscopic illumination device; a heat sink; and a clamp, wherein theclamp is reversibly detachably mounted on the heat dissipation elementsuch that the first end portions of the one or more heat pipes are heldbetween the heat dissipation element and the clamp, wherein the one ormore heat pipes are adapted to conduct the thermal energy of the firstheat source to the heat sink, and wherein the second end portion of theone or more heat pipes ends in the heat sink.
 22. The heat dissipatingdevice of claim 21, wherein the heat source is one or more lights. 23.The heat dissipating device of claim 22, wherein the one or more lightsare one or more LEDs.
 24. The heat dissipating device of claim 21,wherein the clamp is detachably screwed, pinned or bolted to the heatdissipation element.
 25. The heat dissipating device of claim 21,wherein the one or more heat pipes, the heat dissipation element and theclamp include a thermally conductive material.
 26. The heat dissipatingdevice of claim 25, wherein the thermally conductive material includesone or more of aluminum and/or copper.
 27. The heat dissipating deviceof claim 21, wherein a thermal coupling heat-conducting paste is appliedbetween a surface of the heat-dissipating element, a surface of thefirst end region of the one or more heat pipes and a surface of theclamp.
 28. The heat dissipating device of claim 21, further comprisingone or more second heat pipes, a second heat dissipating element, asecond clamp, and a second heat source associated with the endoscopicillumination device, the one or more second heat pipes each having afirst end portion and a second end portion, wherein the second heatdissipation element is configured to dissipate thermal energy from thesecond heat source, wherein the second clamp is reversibly detachablymounted on the second heat dissipation element such that the first endportion of the one or more second heat pipes are held between the secondheat dissipation element and the second clamp, wherein the one or moresecond heat pipes are adapted to conduct the thermal energy of thesecond heat source to the heat sink, and wherein the second end portionof the one or more second heat pipes ends in the heat sink.
 29. The heatdissipating device of claim 21, further comprising one or more secondheat pipes, a second clamp, and a second heat source, the one or moresecond heat pipes each having a first end portion and a second endportion, wherein the heat dissipation element is further configured todissipate thermal energy from the second heat source associated with theendoscopic illumination device, wherein the second clamp is reversiblyreleasably mounted on the heat dissipation element such that the firstend portion of the one or more second heat pipes is held between theheat dissipation element and the second clamp, wherein the one or moresecond heat pipes are adapted to conduct the thermal energy of thesecond heat source to the heat sink, wherein the second end portion ofthe one or more second heat pipes ends in the heat sink.
 30. The heatdissipating device of claim 28, wherein the second heat source is asecond light.
 31. The heat dissipating device of claim 29, wherein thesecond heat source is a second light.
 32. The heat dissipating device ofclaim 30, wherein the second light is one or more LEDs.
 23. The heatdissipating device of claim 31, wherein the second light is one or moreLEDs.
 34. The heat dissipating device of claim 21, further comprising: acooling body forming the heat sink of the device; and a fan adapted toforce an air flow over the heat sink.
 35. The heat dissipating device ofclaim 21, wherein the heat dissipation element and the clamp include oneor more complementary semi-cylindrical recesses adapted to receive oneof the one or more heat pipes.
 36. The heat dissipating device of claim28, wherein the second clamp is detachably screwed, pinned or bolted tothe heat dissipation element.
 37. The heat dissipating device of claim29, wherein the second clamp is detachably screwed, pinned or bolted tothe heat dissipation element.
 38. The heat dissipating device of claim28, wherein the heat pipe, the heat dissipation element and the clampingelement include a thermally conductive material.
 39. The heatdissipating device of claim 38, wherein the thermally conductivematerial includes one or more of aluminum and/or copper.
 40. The heatdissipating device of claim 28, wherein a heat-conducting paste isapplied between a surface of the second heat-dissipating element, asurface of the first end region of the one or more second heat pipes anda surface of the second clamp.
 41. The heat dissipating device of claim21, further comprising: one or more second heat pipes each including afirst end portion and a second end portion; a second heat dissipationelement; and a second clamp, wherein: the heat dissipation element andthe clamp are located on a first plane, and the second heat dissipationelement and the second clamp are located on a second plane perpendicularto the first plane.
 42. The heat dissipating device of claim 41, whereinthere are a plurality of heat pipes and a plurality of second heatpipes, and the plurality of heat pipes are arranged in a parallelconfiguration, and the plurality of second heat pipes are arranged in aparallel configuration.
 43. A heat dissipating device configured todissipate heat from an endoscopic illumination device comprising: aplurality of first heat pipes each including a first end portion and asecond end portion; a plurality of second heat pipes each including afirst end portion and a second end portion; a first heat dissipationelement and a first clamp configured to dissipate thermal energy from afirst heat source associated with the endoscopic illumination device; asecond heat dissipation element and a second clamp also configured todissipate thermal energy from the first heat source; and a heat sinkconnected by the plurality of first heat pipes and the plurality ofsecond heat pipes to the first heat dissipation element and the firstclamp, and the second heat dissipation element and the second clamp,respectively, wherein the clamps are detachably mounted on theirrespective heat dissipation elements such that the first end portions ofthe plurality of first heat pipes are held between the first heatdissipation element and the first clamp, and the first end portions ofthe plurality of second heat pipes are held between the second heatdissipation element and the second clamp, wherein the plurality of heatpipes are adapted to conduct the thermal energy from the first heatsource to the heat sink, and wherein the second end portions of thefirst and the second plurality of heat pipes are located in the heatsink.